Volume 32 Issue 2
Mar.  2023
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YIN Xiangkun, WANG Fengjuan, ZHU Zhangming, et al., “Modeling and Measurement of 3D Solenoid Inductor Based on Through-Silicon Vias,” Chinese Journal of Electronics, vol. 32, no. 2, pp. 365-374, 2023, doi: 10.23919/cje.2020.00.340
Citation: YIN Xiangkun, WANG Fengjuan, ZHU Zhangming, et al., “Modeling and Measurement of 3D Solenoid Inductor Based on Through-Silicon Vias,” Chinese Journal of Electronics, vol. 32, no. 2, pp. 365-374, 2023, doi: 10.23919/cje.2020.00.340

Modeling and Measurement of 3D Solenoid Inductor Based on Through-Silicon Vias

doi: 10.23919/cje.2020.00.340
Funds:  This work was supported in part by the Fok Ying Tung Education Foundation (171112), the Fundamental Research Funds for the Central Universities (JB211110, JB191113), and National Natural Science Foundation of China (62074121).
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  • Author Bio:

    Xiangkun YIN was born in Hunan Province, China. He received the Ph.D. degree from Xidian University in 2017. He is currently an Associate Research Fellow with the School of Microelectronics, Xidian University. His current research interests include 3D ICs based on the TSVs and high-performance RF/Microwave circuits. (Email: yinxkcn@163.com)

    Fengjuan WANG (corresponding author) received the Ph.D. degree from Xidian University in 2014. She is currently a Professor with the School of Automation and Information Engineering, Xi’an University of Technology. Her research interests include TSV-based integrated passive device and 3D ICs. (Email: wfjxiao4@163.com)

    Zhangming ZHU received the Ph.D. degree from Xidian University in 2004. He is currently a Professor with the School of Microelectronics, Xidian University. His current research interests include low power mixed-signal integrated circuits, high speed ADC/DAC, green-power power ICs, and 3D ICs based on the TSVs. (Email: zmyh@263.net)

    F. Pavlidis Vasilis received the Ph.D. degree from University of Rochester in 2008. He is now an Assistant Professor with the School of Computer Science, University of Manchester. His current research interests include interconnect modeling and design, 3D integration, networks-on-chip. (Email: pavlidis@cs.man.ac.uk)

    Xiaoxian LIU received the Ph.D degree in 2015. She is currently an Associate Professor with the School of Microelectronics, Xidian University. Her current research interests focus on the microwave integration for high-speed 3D ICs based on the TSV technology. (Email: liudou132@163.com)

    Qijun LU received the Ph.D degree in microelectronics from Xidian University in 2015. He is currently an Associate Professor with the School of Microelectronics, Xidian University. His current research interests include high performance 3D ICs based on the TSVs. (Email: luqijun2000@126.com)

    Yang LIU received the Ph.D degree from Xidian University in 2017. She is currently an Associate Professor with the school of Microelectronics, Xidian University. Her current research interests include design, modeling, and simulation of through-silicon via-based 3D ICs. (Email: lliu_yang@163.com)

    Yintang YANG received the Ph.D. degree from Xidian University. He is currently the vice president of Xidian University, and a Professor with the School of Microelectronics at Xidian University. His current research interests include high-speed data converters, 3D ICs, network-on-chip, and new semiconductor devices. (Email: ytyang@xidian.edu.cn)

  • Received Date: 2020-10-14
  • Accepted Date: 2022-06-10
  • Available Online: 2022-07-21
  • Publish Date: 2023-03-05
  • Through-silicon via (TSV) provides vertical interconnectivity among the stacked dies in three-dimensional integrated circuits (3D ICs) and is a promising option to minimize 3D solenoid inductors for on-chip radio-frequency applications. In this paper, a rigorous analytical inductance model of 3D solenoid inductor is proposed based on the concept of loop and partial inductance. And a series of 3D samples are fabricated on 12-in high-resistivity silicon wafer using low-cost standard CMOS-compatible process. The results of the proposed model match very well with those obtained by simulation and measurement. With this model, the inductance can be estimated accurately and efficiently over a wide range of inductor windings, TSV height, space, and pitch.
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