Circuit Modeling and Performance Analysis of GNR@SWCNT Bundle Interconnects

ZHAO Wensheng; YUAN Mengjiao; WANG Xiang; WANG Dawei

doi:10.23919/cje.2021.00.379

Volume 32 Issue 6

Nov. 2023

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Article Navigation > Chinese Journal of Electronics > 2023 > 32(6): 1271-1277

ZHAO Wensheng, YUAN Mengjiao, WANG Xiang, et al., “Circuit Modeling and Performance Analysis of GNR@SWCNT Bundle Interconnects,” Chinese Journal of Electronics, vol. 32, no. 6, pp. 1271-1277, 2023, doi: 10.23919/cje.2021.00.379

Citation:

ZHAO Wensheng, YUAN Mengjiao, WANG Xiang, et al., “Circuit Modeling and Performance Analysis of GNR@SWCNT Bundle Interconnects,” Chinese Journal of Electronics, vol. 32, no. 6, pp. 1271-1277, 2023, doi: 10.23919/cje.2021.00.379

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Circuit Modeling and Performance Analysis of GNR@SWCNT Bundle Interconnects

doi: 10.23919/cje.2021.00.379

1.
Zhejiang Provincial Key Lab of Large-Scale IC Design, School of Electronics and Information, Hangzhou Dianzi University, Hangzhou 310018, China

Funds: This work was supported by the Zhejiang Provincial Natural Science Foundation of China (LXR22F040001).

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Author Bio:
Wensheng ZHAO received the B.E. degree in electronic science and technology from Harbin Institute of Technology, Harbin, China, in 2008, and the Ph.D. degree from Zhejiang University, Hangzhou, China, in 2013. He is currently a Full Professor of Hangzhou Dianzi University, Hangzhou. His research interests include IC interconnect, advanced packaging, multiphysics, and microwave components. (Email: wshzhao@hdu.edu.cn)

Mengjiao YUAN received the B.E. degree in electronic information science and technology from Henan University of Technology in 2019 and the M.E. degree from Hangzhou University of Electronic Science and Technology in 2022. Her research direction is based on the research of on-chip interconnection of carbon nano materials. (Email: 13939543987@163.com)

Xiang WANG (corresponding author) is an Associate Professor with Hangzhou Dianzi University, Hangzhou, China. His research interests include IC interconnect modeling and simulation. (Email: wangxiang@hdu.edu.cn)

Dawei WANG is an Associate Professor with Hangzhou Dianzi University, Hangzhou, China. His research interests include IC interconnect, multiphysics, and numerical algorithms. (Email: davidw.zoeq@hdu.edu.cn)
Received Date: 2021-11-01
Accepted Date: 2022-08-03

Available Online: 2023-02-17

Publish Date: 2023-11-05

Abstract

Abstract

In this paper, the single-walled carbon nanotube (SWCNT) with graphene nanoribbon (GNR) inside, namely GNR@SWCNT, is proposed as alternative conductor material for the interconnect applications. The equivalent circuit model is established, and the circuit parameters extracted analytically. By virtue of the equivalent circuit model, the signal transmission performance of GNR@SWCNT bundle interconnect is evaluated and compared with its Cu and SWCNT counterparts. The optimal repeater insertions in global- and intermediate-level GNR@SWCNT bundle interconnect are studied. Moreover, it is demonstrated that the GNR@SWCNT interconnects could provide superior performance, indicating that GNR@SWCNT structure would be beneficial for development of future carbon-based integrated circuits and systems.
- GNR@SWCNT bundle,
- On-chip interconnect,
- Equivalent circuit mode,
- Time delay,
- Repeater insertion

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References(27)

References

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