TANG Wei, JING Bo, HUANG Yifeng, et al., “Multistate Degradation Model for Prognostics of Solder Joints Under Vibration Conditions,” Chinese Journal of Electronics, vol. 25, no. 4, pp. 779-785, 2016, doi: 10.1049/cje.2016.07.012
Citation: TANG Wei, JING Bo, HUANG Yifeng, et al., “Multistate Degradation Model for Prognostics of Solder Joints Under Vibration Conditions,” Chinese Journal of Electronics, vol. 25, no. 4, pp. 779-785, 2016, doi: 10.1049/cje.2016.07.012

Multistate Degradation Model for Prognostics of Solder Joints Under Vibration Conditions

doi: 10.1049/cje.2016.07.012
Funds:  This work is supported by the National Natural Science Foundation of China (No.51201182), and the Natural Science Foundation of Shaanxi Province, China (No.2015JM6345).
  • Received Date: 2015-02-11
  • Rev Recd Date: 2015-08-26
  • Publish Date: 2016-07-10
  • This paper develops a multistate degradation structure of the solder joints which can be used under various vibration conditions based on nonhomogeneous continuous-time hidden semi-Markov process. The parameters of the structure were estimated to illustrate the stochastic relationship between the degradation process and the monitoring indicator by using unsupervised learning methods. Random vibration tests on solder joints with different levels of power spectral density and fixed forms were conducted with a real time monitoring electrical resistance to examine the suitability of the model. It was experimentally verified that the multistate degradation structure matches the experimental process reasonably and accurately. Based on this multistate degradation model, the online prognostics of solder joint were analyzed and the results indicated that faults or failures can be detected timely, leading to appreciate maintenance actions scheduled to avoid catastrophic failures of electronics.
  • loading
  • Z. Zeng, X. Li, M. Li, et al., "Analysis of power consumption on laser solder joints of electric connector", Chinese Journal of Electronics, Vol.23, No.4, pp.666-668, 2014.
    A.M. Veprik, "Vibration protection of critical components of electronic equipment in harsh environmental conditions", Journal of Sound and Vibration, Vol.259, No.1, pp.161-175, 2003.
    S.M. Rezvanizaniani, Z. Liu, Y. Chen, et al., "Review and recent advances in battery health monitoring and prognostics technologies for electric vehicle (EV) safety and mobility", Journal of Power Sources, Vol.256, No.12, pp.110-124, 2014.
    C. Han, C.M. Oh and W.S. Hong, "Prognostics model development of BGA assembly under vibration environment", IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol.2, No.8, pp.1329-1334, 2012.
    P. Lall, R. Lowe and K. Goebel, "Extended Kalman filter models and resistance spectroscopy for prognostication and health monitoring of leadfree electronics under vibration", IEEE Transactions on Reliability, Vol.61, No.4, pp.858-871, 2012.
    Y. Cinar and G. Jang, "Fatigue life estimation of FBGA memory device under vibration", Journal of Mechanical Science and Technology, Vol.28, No.1, pp.107-114, 2014.
    J. Gu, D. Barker and M. Pecht, "Prognostics implementation of electronics under vibration loading", Microelectronics reliability, Vol.47, No.12, pp.1849-1856, 2007.
    D. Yu, A. Al-Yafawi, T.T. Nguyen, et al., "High-cycle fatigue life prediction for Pb-free BGA under random vibration loading", Microelectronics Reliability, Vol.51, No.3, pp.649-656, 2011.
    M.L. Wu, "Vibration-induced fatigue life estimation of ball grid array packaging", Journal of Micromechanics and Microengineering, Vol.19, No.6, pp.065005, 2009.
    F.X. Che and J.H.L. Pang, "Vibration reliability test and finite element analysis for flip chip solder joints", Microelectronics reliability, Vol.49, No.7, pp.754-760, 2009.
    E.H. Wong, S.K.W. Seah, D.W.D. Van, et al., "Advances in the drop-impact reliability of solder joints for mobile applications", Microelectronics Reliability, Vol.49, No.2, pp.139-149, 2009.
    K. Javed, R. Gouriveau and N. Zerhouni, "A new multivariate approach for prognostics based on extreme learning machine and fuzzy clustering", IEEE Transactions on Cybernetics, Vol.99, No.1, pp.1-13, 2015.
    S.J. Bae, W. Kuo and P.H. Kvam, "Degradation models and implied lifetime distributions", Reliability Engineering & System Safety, Vol.92, No.5, pp.601-608, 2007.
    S.T. Tseng, N. Balakrishnan, C.C Tsai, et al., "Optimal step-stress accelerated degradation test plan for gamma degradation processes", IEEE Transactions on Reliability, Vol.58, No.4, pp.611-618, 2009.
    R. Moghaddass, M.J. Zuo and Y. Liu, "Predictive analytics using a nonhomogeneous semi-Markov model and inspection data", IIE Transactions on Special Issue:Quality and Reliability Engineering, Vol.47, No.5, pp.505-520, 2015.
    A. Blasi, J. Janssen and R. Manca, "Numerical treatment of homogeneous and non-homogeneous semi-markov reliability models", Communications in Statistics-Theory and Methods, Vol.33, No.3, pp.697-714, 2004.
    R. Moghaddass and M.J. Zuo, "An integrated framework for online diagnostic and prognostic health monitoring using a multistate deterioration process", Reliability Engineering & System Safety, Vol.124, No.4, pp.92-104, 2014.
    S.L. Shieh and I.E. Liao, "A new approach for data clustering and visualization using self-organizing maps", Expert Systems with Applications, Vol.39, No.15, pp.11924-11933, 2012.
    T. Boutros and M. Liang, "Detection and diagnosis of bearing and cutting tool faults using hidden Markov models", Mechanical Systems and Signal Processing, Vol.25, No.6, pp.2102-2124, 2011.
    F. Yin, H. Mao and L. Hua, "A hybrid of back propagation neural network and genetic algorithm for optimization of injection molding process parameters", Materials & Design, Vol.32, No.6, pp.3457-3464, 2011.
    C.U. Kim, W.H. Bang, H. Xu, et al., "Characterization of solder joint reliability using cyclic mechanical fatigue testing", Journal of the Minerals Metals & Materials Society, Vol.65, No.10, pp.1362-1373, 2013.
    K.C. Otiaba, M.I. Okereke and R.S. Bhatti, "Numerical assessment of the effect of void morphology on thermo-mechanical performance of solder thermal interface material", Applied Thermal Engineering, Vol.64, No.1, pp.51-63, 2014
    W. Yao and C. Basaran, "Electromigration damage mechanics of lead-free solder joints under pulsed DC:A computational model", Computational Materials Science, Vol.71, No.7, pp.76-88, 2013.
    D.A. Tobon-Mejia, K. Medjaher, N. Zerhouni, et al., "A data-driven failure prognostics method based on mixture of Gaussians hidden Markov models", IEEE Transactions on Reliability, Vol.61, No.2, pp.491-503, 2012.
    G.E.P. Box and G.C. Tiao, Bayesian Inference in Statistical Analysis, John Wiley & Sons, New York, USA, pp.31-42, 2011.
  • 加载中


    通讯作者: 陈斌, bchen63@163.com
    • 1. 

      沈阳化工大学材料科学与工程学院 沈阳 110142

    1. 本站搜索
    2. 百度学术搜索
    3. 万方数据库搜索
    4. CNKI搜索

    Article Metrics

    Article views (307) PDF downloads(716) Cited by()
    Proportional views


    DownLoad:  Full-Size Img  PowerPoint