Analytical Models of Passive Linear Structures in Printed Circuit Boards

PENG Zhenzhen; SU Donglin

doi:10.1049/cje.2020.08.017

Volume 30 Issue 2

Apr. 2021

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PENG Zhenzhen and SU Donglin, “Analytical Models of Passive Linear Structures in Printed Circuit Boards,” Chinese Journal of Electronics, vol. 30, no. 2, pp. 275-281, 2021, doi: 10.1049/cje.2020.08.017

Citation:

PENG Zhenzhen and SU Donglin, “Analytical Models of Passive Linear Structures in Printed Circuit Boards,” Chinese Journal of Electronics, vol. 30, no. 2, pp. 275-281, 2021, doi: 10.1049/cje.2020.08.017

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Analytical Models of Passive Linear Structures in Printed Circuit Boards

doi: 10.1049/cje.2020.08.017

PENG Zhenzhen^1
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SU Donglin^{1, 2
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1.
The School of Electronic and Information Engineering, Beihang University, Beijing 100191, China
2.
The Research Institute for Frontier Science, Beihang University, Beijing 100191, China

Funds:

the National Natural Science Foundation of China 61427803

the National Natural Science Foundation of China 61771032

the Civil Aircraft Projects of China MJ-2017-F-11

More Information

Author Bio:
PENG Zhenzhen received the B.S. degree in communication engineering from Harbin Engineering University, Harbin, China, in 2015. She is currently pursuing the Ph.D. degree at Beihang University, Beijing, China. Her current research interests include physics based modeling of circuit-domain, equivalent circuit modeling for signal integrity and electromagnetic compatibility problems. (Email: by1502167@buaa.edu.cn)
Corresponding author: SU Donglin (corresponding author) received the B.S., M.S., and Ph.D. degrees in electrical engineering from Beihang University (BUAA), Beijing, China, in 1983, 1986, and 1999, respectively. In 1986, she joined the Faculty of School of Electronics and Information Engineering, BUAA, where she was first an Assistant, then a Lecturer, later on an Associate Professor, and is currently a Full Professor. Her research interests include the numerical methods for microwave and millimeter-wave integrated circuits and systematic electromagnetic compatibility design of various aircrafts. (Email: sdl@buaa.edu.cn)
Received Date: 2020-08-20
Accepted Date: 2020-08-28
Publish Date: 2021-03-01

Abstract

Abstract

Analytical models for passive linear structures, like metallic traces, vias, are proposed for simulations at the package and Printed circuit board (PCB) levels. In the proposed method, traces are modeled based on the transmission line theory, whereas the vias are described by the parallel-plate impedance and several equivalent circuits elements. The proposed models can be applied to efficiently simulate composed passive linear structures. Several scenarios are analyzed including traces with two or three width, traces routed into different layers and interconnects commonly used in PCBs. The results of the models are compared with those from the fullwave simulations and experiments. An improvement on the computation speed has been observed with respect to the full-wave simulations at the effective range of models. In our measurements, a compensation approach of impedance mismatch in parameter measurements is analyzed and calculated, which could significantly simplify the experimental process.
- Equivalent circuits,
- Parallel-plate impedance,
- Printed circuit boards,
- Trace,
- Transmission line theory,
- Via

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References(32)

References

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