220 GHz Multi Circuit Integrated Front End Based on Solid-State Circuits for High Speed Communication System

NIU Zhongqian; ZHANG Bo; DAI Bingli; ZHANG Jicong; SHEN Fang; HU Yi; FAN Yong; ZHANG Yihan

doi:10.1049/cje.2021.00.295

Volume 31 Issue 3

May 2022

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Article Navigation > Chinese Journal of Electronics > 2022 > 31(3): 569-580

NIU Zhongqian, ZHANG Bo, DAI Bingli, et al., “220 GHz Multi Circuit Integrated Front End Based on Solid-State Circuits for High Speed Communication System,” Chinese Journal of Electronics, vol. 31, no. 3, pp. 569-580, 2022, doi: 10.1049/cje.2021.00.295

Citation:

NIU Zhongqian, ZHANG Bo, DAI Bingli, et al., “220 GHz Multi Circuit Integrated Front End Based on Solid-State Circuits for High Speed Communication System,” Chinese Journal of Electronics, vol. 31, no. 3, pp. 569-580, 2022, doi: 10.1049/cje.2021.00.295

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220 GHz Multi Circuit Integrated Front End Based on Solid-State Circuits for High Speed Communication System

doi: 10.1049/cje.2021.00.295

1.
School of Electronic Science and Engineering, University of Electronic Science and Technology of China, Chengdu 610054, China
2.
Chongqing Institute of Microelectronics Industry Technology, University of Electronic Science and Technology of China, Chongqing 401332, China

Funds: This work was supported by the National Natural Science Foundation of China (61771116, 62022022, 62101107), the National Key R&D Program of China (2018YFB1801502), and China Postdoctoral Science Foundation (2021TQ0057).

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Author Bio:
was born in Luoyang, China, in 1991. He received the B.E. and Ph.D. degrees in electronic science and technology from the University of Electronic Science and Technology of China (UESTC), Chengdu, China, in 2014 and 2020, where he is currently a Postdoc in terahertz solid-state devices and systems at School of Electronic Science and Engineering and Chongqing Institute of Microelectronics Industry Technology, UESTC. His research interests are terahertz high speed communication system, terahertz mixers, and other terahertz devices. (Email: hnlynzq2008@163.com)

(corresponding author) received the B.E., M.S., and Ph.D. degrees in electromagnetic field and microwave technology from the University of Electronic Science and Technology of China, Chengdu, China, in 2004, 2007, and 2011, respectively. He became a Member (M) of IEEE in 2007, a Senior Member (SM) in 2015. He is currently a Professor at School of Electronic Science and Engineering, University of Electronic Science and Technology of China, Chengdu, China. His research interests are terahertz solid state technology and system. (Email: zhangbouestc@yeah.net)

received the B.E degree in electromagnetic field and wireless technology from the University of Electronic Science and Technology of China (UESTC), Chengdu, China, in 2019. He is currently working towards Ph.D. degree in UESTC. His research interests include microwave, millimeter-wave, terahertz solid-state circuits and terahertz communication system
Received Date: 2021-08-19
Accepted Date: 2021-09-28

Available Online: 2022-03-04

Publish Date: 2022-05-05

Abstract

Abstract

This paper presents the research on a 220 GHz multi circuit inte-grated front end based on solid-state circuits. This integrated front end integrates a 220 GHz subharmonic mixer, a 110 GHz tripler, a 110 GHz 8 dB hybrid coupler and a 220 GHz waveguide bandpass filter (BPF) in one single block. Compared to the traditional transceivers which usually use cascade connection of the independent mixers and multipliers, the size of the proposed multi circuit integrated front-end block is 25 mm × 20 mm × 20 mm, ten times smaller than the cascading transceiver. In order to check the tripler’s output power, a modified compact 110 GHz 8 dB hybrid coupler is set between mixer and tripler. Due to the characteristics of the hybrid coupler, the deterioration of cascading transceiver’s performance caused by mismatch has also been improved. In addition, to achieve single sideband (SSB) communication, a 220 GHz BPF with high selectivity is integrated in the circuit. The measured conversion loss of the fabricated multi circuit integrated front end is less than 11 dB, where the LO and RF frequency are 37 and 210−220 GHz. Based on this front-end, a 220 GHz high speed communication system has been setup and it can achieve 10 Gbps data transmission using 16QAM modulation.
- THz solid state circuits,
- Low connection loss,
- Multi circuit integrated front end,
- Miniaturization,
- Single sideband communication

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References(35)

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