VLSI Design for High-Precision Three-Dimensional Depth Perception Chip

GE Chenyang; YAO Huimin; ZHOU Yanhui; DENG Pengchao

doi:10.1049/cje.2021.04.009

Volume 30 Issue 3

May 2021

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Article Navigation > Chinese Journal of Electronics > 2021 > 30(3): 556-560

GE Chenyang, YAO Huimin, ZHOU Yanhui, et al., “VLSI Design for High-Precision Three-Dimensional Depth Perception Chip,” Chinese Journal of Electronics, vol. 30, no. 3, pp. 556-560, 2021, doi: 10.1049/cje.2021.04.009

Citation:

GE Chenyang, YAO Huimin, ZHOU Yanhui, et al., “VLSI Design for High-Precision Three-Dimensional Depth Perception Chip,” Chinese Journal of Electronics, vol. 30, no. 3, pp. 556-560, 2021, doi: 10.1049/cje.2021.04.009

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VLSI Design for High-Precision Three-Dimensional Depth Perception Chip

doi: 10.1049/cje.2021.04.009

1. Institute of Artificial Intelligence and Robotics, Xi'an Jiaotong University, Xi'an 710049, China;
2. Institute of electromagnetic and information technology, Xi'an Jiaotong University, Xi'an 710049, China

Funds:

This work is supported by the National Natural Science Foundation of China (No.61627811).

Received Date: 2016-11-08

Abstract

Abstract

This paper presents a Very large scale integration (VLSI) design method for Three-dimensional (3D) depth perception chip based on infrared coding structure light. The primary sub-modules on the chip contain the speckle pattern preprocessing module, block-matching disparity estimation, depth mapping and post-processing. The chip employs pipelining technology, and after Application specific integrated circuit (ASIC) verification, it proves that our chip has more advantages in performance of depth precision (12bits, 1mm @ 1m), image resolution (1280×960), time delay (less than 17ms), range limit (0.4~6m). It also can generate more stable and smooth depth map in real-time, which can be used in 3D recognition, motion capture or scene perception.
- 3D depth perception,
- structure light coding,
- VLSI,
- ASIC

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References(16)

References

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