ZENG Zhi, LI Xunbo, LI Miao, et al., “Analysis of Power Consumption on Laser Solder Joints of Electric Connector,” Chinese Journal of Electronics, vol. 23, no. 4, pp. 666-668, 2014,
Citation: ZENG Zhi, LI Xunbo, LI Miao, et al., “Analysis of Power Consumption on Laser Solder Joints of Electric Connector,” Chinese Journal of Electronics, vol. 23, no. 4, pp. 666-668, 2014,

Analysis of Power Consumption on Laser Solder Joints of Electric Connector

Funds:  This work is supported by the National Natural Science Foundation of China (No.51205047).
  • Received Date: 2013-10-01
  • Rev Recd Date: 2013-12-01
  • Publish Date: 2014-10-05
  • Laser soldering process was introduced in Universal serial bus (USB) 2.0 electric connector to improve the mechanical and electrical bonding reliability. While, the effects of laser soldering technology on electric connector solder joints need to be estimated completely, especially on power consumption. The combined method based on numerical simulation and the Accelerated temperature experiment (ATE) was developed to analyze the power consumption of USB 2.0 electric connector in this paper. The ATE contains thermal cycle and thermal shock tests, and the four-electrode method is used to obtain the conductivity of solder joints. Numerical modeling and analysis was used to quantify the power consumption and optimize the geometry of solder joints, because the electric experimental measurements of power consumption during ATE are time-costing and often intractable. Accurate knowledge of the power consumption is a prerequisite for the reliability of the electric connector.
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