LI Jianwei, DONG Gang, WANG Zeng, YE Xiaochun. Statistical Interconnect Crosstalk Noise Model and Analysis for Process Variations[J]. Chinese Journal of Electronics, 2015, 24(1): 83-87.
Citation: LI Jianwei, DONG Gang, WANG Zeng, YE Xiaochun. Statistical Interconnect Crosstalk Noise Model and Analysis for Process Variations[J]. Chinese Journal of Electronics, 2015, 24(1): 83-87.

Statistical Interconnect Crosstalk Noise Model and Analysis for Process Variations

Funds:  This work is supported by the Opening Project of State Key Laboratory of Computer Architecture (No.CARCH201109), the National Natural Science Foundation of China (No.60606006), and the Key Discipline Project in Shaanxi Province (No. 107000090803).
  • Received Date: 2013-04-01
  • Rev Recd Date: 2013-06-01
  • Publish Date: 2015-01-10
  • When operating frequency is over several gigahertz, the effect of inductance plays an important role and should be included for accurate and speed crosstalk noise analysis. And for new generation IC (Integrated circuit) design tools, the crosstalk noise analysis tools should consider the influence of process variations. In this paper, we propose coupled RLC crosstalk noise distributed parameter model with capacitive load termination. And we develop the framework that how to use the crosstalk noise model for process variations. Our results show that compare with HSPICE, the critical data errors of proposed model are within 1% and the relative errors occurred between calculated values for process variations and HSPICE Monte Carlo simulation values are less than 5%. The key features of the new model include: (1) The impact of inductance on crosstalk noise is considered; (2) The model can be used for process variations analysis; (3) The model reflect the effects of load capacitance directly; (4) The numerical inversion of Laplace transform is introduced for improving speed. So the proposed model meets the needs of future IC design both in speed and accuracy.
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